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Asscon VP800

Description | Request a Quote

Universally Applicable, Flexible Reflow Soldering System.

Key Features

  • Void free solder joints by application of vacuum treatment of the assembly after melting
  • Suitable for lead-free applications without any limitation
  • No time-expensive preparation of temperature profiles
  • Short heating-up time
  • Operator convenience with microprocessor controlling
  • Automatic operation in a production line (SMEMA-interface definition)

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