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Asscon VP2000/VP7000
Description |
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Universally Applicable, Flexible Reflow Soldering System.
Key Features
Void free solder joints by application of vacuum treatment of the assembly after melting
Suitable for lead-free applications without any limitation
No time-expensive preparation of temperature profiles
Short heating-up time
Operator convenience with microprocessor controlling
Automatic operation in a production line (SMEMA-interface definition)
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