Asscon VP2000/VP7000

Universally Applicable, Flexible Reflow Soldering System.

Key Features

• Void free solder joints by application of vacuum treatment of the assembly after melting
• Suitable for lead-free applications without any limitation
• No time-expensive preparation of temperature profiles
• Short heating-up time
• Operator convenience with microprocessor controlling
• Automatic operation in a production line (SMEMA-interface definition)

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