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Cleaning Application:
Defluxing-removing soldering residues after reflow.
Cleaning contamination from handling and board manufacturing, removing FOD.
High density electronic assemblies with low standoffcomponents like BGA,CSP,BTC,QFN,MELF, small chips
Cleaning of power electronics.
Electronic assemblies requiring extra short process time.
Second side misprints on complex assemblies.
Cleaning before conformal coating and wire bonding.
High volume stencil cleaning
Check the Spec
– Ultimate cleaning performance
– Easy operation
– Zero drain concept
– Linear direct spray for equal washing
– Hot air knife direct dry
– Illuminated glass door chamber for visual process control
– Quick changover to Twingo – double capacity configuration
– Wide range of standard and customized PCBA fixtures
– Clamping for all types of stencils
– Simple detailed programming
– Complete datalogging and bar code traceability
– Up to 3 fully separated liquid loops
– Low consumption of chemicals and water
– Outstanding options of water utilization
– Adaptive rinse water quality control
– Automatic chemical concentration control
