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Universal Cleaning Solution in One System
Cleaning Application :
Defluxing-Removing all kind of solder residues.
Cleaning of micromechanical components.
Cleaning contamination from handling and board manufacturing, removing FOD.
Highly populated electronic assemblies with low standoff components such as BGA,CSP,BTC,QFN,MELF.
Cleaning of power electronics.
Electronic assemblies requiring extra short process time.
Second side misprints on complex assemblies.
Cleaning before conformal coating and wire bonding.
Check the Spec
– Fully automatic spray-in-air closed loop zero drain system.
– Double capacity configuration TWINGO.
– Multiple capacity in COMBO configuration.
– 100% filtration of the entire spray volume.
– Double rinse option.
– Hot air knife direct dry technology.
– Clamping for all types of stencils.
– Low consumption of chemicals and water.
– Proportional level sensors in all processes.
– Outstanding options of water utilization.