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Defluxing – removing all kind of solder residues

Cleaning of micromechanical components

Cleaning contamination from handling and board manufacturing, removing FOD

Highly populated electronic assemblies with low standoff components such as BGA, CSP, BTC, QFN, MELF

Cleaning of power electronics

Electronic assemblies requiring extra short process time

Second side misprints on complex assemblies

Cleaning before conformal coating and wire bonding

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