Soldering and cleaning equipment for electronics manufacturing industry
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Essemtec Tarantula

All-Terrain Jet Dispenser

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The Tarantula – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more. Integrate into high speed lines and highly complex dispense applications. Three processes at the same time. Plug and Play for valve change. Piezo Jet Valve – super high speed for low viscosity. Solder Jet, Volume Displacement, Time/Pressure, Archimedean Screw Valve. Full operator support – Automated error analysis & KPI. Training, support and troubleshooting via advanced remote access. Investment protection; all options and heads retrofittable.

Check the Spec

Dispense Technology:
– Up to 3 dispense valves simultaneously
– 5 different valves, large application range
Process Control:
– Monitoring sizes and weight of dispense dots
– Process control adjustment and dot stabilisation
– Up to 145’000 dots/h (with piezo jet valve)
– Up to 2’000’000 dot/h line mode
Large Dispense Area:
– PCB size 560×610 mm, optional 1’800×610 mm Up to 80 mm(3.35″) Z stroke
Height Mapping:
– Mapping of heights using laser technology
Linear Motors:
– Fast reliable double drive linear motors
– No maintenance, longest lifetime

SKU: est001 Category:

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