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The modern design of the machines and the physical laws of the process permit to defect-free soldering of the most complicated SMT assemblies even with lead-free solder pastes. The machines are particular suited for users who process product with frequently changing assemblies in small and medium sized quantities. Universal workpiece carries make the system very flexible.
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– User-friendly, intelligent SMT reflow soldering system.
– Oxygen-free-process, oxygen-free pre-heating and soldering process.
– Lead-free capable without restriction.
– ASB (automatic-solder-break), automatic recognition of the completed soldering process.
– TGC (temperature-gradient-control), adjustable Temperature gradients in the pre-heating zone.
– OPC (optical-process-control), visual process control.
– Storage of soldering programs.
– Low operating costs due to efficient energy use.