Heller 1809 MK3

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Best value SMT Reflow Oven in the market. Designed for Low Cost of Ownership.

• 1809 Mark III
• 1809 Mark III (with optional 3rd cooling zone)

The 1800 models support high mix / high volume throughput... at speeds up to 80 centimetres per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.

Highest Yields and Tight Process Control
• The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.
• Wide process window for "universal profiling" - allows many different boards to be run on a single temperature profile
• Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs

With a high-capacity, 660mm wide heater module, the 1809 Mark III series reflow oven offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo, to carry even the largest boards or multi-board panels (up to 508mm wide) through the oven.

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